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Relationship between interfacial stress and thermal expansion coefficient of copper-matrix composites with different reinforced phases
Relationship between interfacial stress and thermal expansion coefficient of copper-matrix composites with different reinforced phases
Relationship between interfacial stress and thermal expansion coefficient of copper-matrix composites with different reinforced phases
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 30 ; 171-175
01.01.2014
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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