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Thermally Induced Piezothermoelastic Fields of a Smart Sandwich Cylindrical Structure with a Functionally Graded Interlayer
Thermally Induced Piezothermoelastic Fields of a Smart Sandwich Cylindrical Structure with a Functionally Graded Interlayer
Thermally Induced Piezothermoelastic Fields of a Smart Sandwich Cylindrical Structure with a Functionally Graded Interlayer
Wang, H.M. (Autor:in)
JOURNAL OF THERMAL STRESSES ; 37 ; 585-603
01.01.2014
19 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1121
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