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Fracture analysis in piezoelectric semiconductors under a thermal load
Fracture analysis in piezoelectric semiconductors under a thermal load
Fracture analysis in piezoelectric semiconductors under a thermal load
Sladek, J. (Autor:in) / Sladek, V. (Autor:in) / Pan, E. (Autor:in) / Wunsche, M. (Autor:in)
ENGINEERING FRACTURE MECHANICS ; 126 ; 27-39
01.01.2014
13 pages
Aufsatz (Zeitschrift)
Englisch
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