Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Cyclic stress-strain response and microstructure evolution of polycrystalline Cu under pure compressive cyclic loading condition
Cyclic stress-strain response and microstructure evolution of polycrystalline Cu under pure compressive cyclic loading condition
Cyclic stress-strain response and microstructure evolution of polycrystalline Cu under pure compressive cyclic loading condition
Hsu, T. Y. J. (Autor:in) / Wang, Z. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 615 ; 302-312
01.01.2014
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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