Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The Minimum Cutting Thickness in Milling Process Simulation Analysis
The Minimum Cutting Thickness in Milling Process Simulation Analysis
The Minimum Cutting Thickness in Milling Process Simulation Analysis
Wang, X.B. (Autor:in) / Li, D. (Autor:in) / Chen, N. (Autor:in) / Chen, M.J. (Autor:in)
MATERIALS SCIENCE FORUM ; 800/801 ; 264-268
01.01.2014
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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