Corrosion protection of copper by polypyrrole film studied by electrochemical impedance spectroscopy and the electrochemical quartz microbalance: Fid-Bau Portal

Corrosion protection of copper by polypyrrole film studied by electrochemical impedance spectroscopy and the electrochemical quartz microbalance

Lei, Y. / Ohtsuka, T. / Sheng, N.

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Corrosion protection of copper by polypyrrole film studied by electrochemical impedance spectroscopy and the electrochemical quartz microbalance

Lei, Y. / Ohtsuka, T. / Sheng, N.

Corrosion protection of copper by polypyrrole film studied by electrochemical impedance spectroscopy and the electrochemical quartz microbalance

Lei, Y. / Ohtsuka, T. / Sheng, N.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Titel:

Corrosion protection of copper by polypyrrole film studied by electrochemical impedance spectroscopy and the electrochemical quartz microbalance

Beteiligte:

Lei, Y. (Autor:in) / Ohtsuka, T. (Autor:in) / Sheng, N. (Autor:in)

Erschienen in:

APPLIED SURFACE SCIENCE ; 357 ; 1122-1132

Erscheinungsdatum:

01.01.2015

Format / Umfang:

11 pages

ISSN:

0169-4332

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 621.35

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