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Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation
Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation
Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation
Yahaya, M. Z. (Autor:in) / Ani, F. C. (Autor:in) / Samsudin, Z. (Autor:in) / Sahin, S. (Autor:in) / Abdullah, M. Z. (Autor:in) / Mohamad, A. A. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 669 ; 178-186
01.01.2016
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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