Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
New encapsulation method using low-melting-point alloy for sealing micro heat pipes
New encapsulation method using low-melting-point alloy for sealing micro heat pipes
New encapsulation method using low-melting-point alloy for sealing micro heat pipes
Congming, L. (Autor:in) / Xiaodong, W. (Autor:in) / Chuanpeng, Z. (Autor:in) / Yi, L. (Autor:in) / Zhixin, L. (Autor:in) / Sidi, L. (Autor:in)
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 31 ; 2621-2626
01.01.2017
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621
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