Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermomechanical characterization of a nanoscale copper thin-film using picosecond ultrasonics
Thermomechanical characterization of a nanoscale copper thin-film using picosecond ultrasonics
Thermomechanical characterization of a nanoscale copper thin-film using picosecond ultrasonics
Kim, Y. Y. (Autor:in)
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING ; 18 ; 1245-1251
01.01.2017
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621
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