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The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

Lipińska, M. / Olejnik, L. / Lewandowska, M. g.

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The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

Lipińska, M. / Olejnik, L. / Lewandowska, M. g.

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

Lipińska, M. / Olejnik, L. / Lewandowska, M. g.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

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Ähnliche Titel

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Titel:

The influence of an ECAP-based deformation process on the microstructure and properties of electrolytic tough pitch copper

Beteiligte:

Lipińska, M. (Autor:in) / Olejnik, L. (Autor:in) / Lewandowska, M. g. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS SCIENCE ; 53 ; 3862-3875

Erscheinungsdatum:

01.01.2018

Format / Umfang:

14 pages

ISSN:

0022-2461

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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