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Study of electromechanical impedance changes caused by modifications of cfrp adhesive bonds
Study of electromechanical impedance changes caused by modifications of cfrp adhesive bonds
Study of electromechanical impedance changes caused by modifications of cfrp adhesive bonds
Malinowski, Paweł H. (Autor:in) / Ostachowicz, Wiesław M. (Autor:in) / Brune, Kai (Autor:in) / Schlag, Mareike (Autor:in)
FATIGUE AND FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES ; 40 ; 1592-1600
01.01.2017
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1123
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