Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Electrochemical Migration of Sintered Nanosilver Under Chloride-Containing Thin Electrolyte Layer for Power Electronic Packaging
Electrochemical Migration of Sintered Nanosilver Under Chloride-Containing Thin Electrolyte Layer for Power Electronic Packaging
Electrochemical Migration of Sintered Nanosilver Under Chloride-Containing Thin Electrolyte Layer for Power Electronic Packaging
Zheng, Yana (Autor:in) / Mei, Yunhui (Autor:in) / Long, Fei (Autor:in) / Li, Xin (Autor:in) / Yan, Chaoyi (Autor:in) / Lu, Guo-Quan (Autor:in)
Corrosion ; 72 ; 547-559
01.01.2016
13 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11223
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Electrochemical migration of tin in thin electrolyte layer containing chloride ions
British Library Online Contents | 2013
|Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging
British Library Online Contents | 2014
|British Library Online Contents | 2016
|British Library Online Contents | 2016
|British Library Online Contents | 2016
|