Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Idealization of Bond Stress-Slip Relationship at Elevated Temperatures Based on Pullout Tests
Idealization of Bond Stress-Slip Relationship at Elevated Temperatures Based on Pullout Tests
Idealization of Bond Stress-Slip Relationship at Elevated Temperatures Based on Pullout Tests
Raouffard, Mohammad Mahdi (Autor:in) / Nishiyama, Minehiro (Autor:in)
ACI materials journal ; 115 ; 391-400
01.01.2018
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.136
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