Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Instantaneous Uncut Chip Thickness Model in End Milling Based on an Improved Method
Instantaneous Uncut Chip Thickness Model in End Milling Based on an Improved Method
Instantaneous Uncut Chip Thickness Model in End Milling Based on an Improved Method
Zhang, Y. (Autor:in) / Yu, Z. Q. (Autor:in) / Wang, T. Y. (Autor:in)
Key engineering materials ; 764 ; 399-407
01.01.2018
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
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