Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Probes for Very Small Pitch Bump Arrays Using a High Resolution 3D Printer
Probes for Very Small Pitch Bump Arrays Using a High Resolution 3D Printer
Probes for Very Small Pitch Bump Arrays Using a High Resolution 3D Printer
Nagata, Hitoshi (Autor:in) / Fan, Liwen (Autor:in) / Takeda, Tomoyuki (Autor:in) / Hattori, Sachiko (Autor:in) / Aoyagi, Seiji (Autor:in) / Suzuki, Masato (Autor:in) / Saiki, Tsunemasa (Autor:in) / Takizawa, Yukako (Autor:in) / Ando, Taeko (Autor:in) / Sugiyama, Susumu (Autor:in)
Erekutoronikusu Jisso Gakkaishi = ; 21 ; 586-589
01.01.2018
4 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
621.381046
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