Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Size and distribution of micropores and voids in 5052 aluminum alloys during tensile deformation
Size and distribution of micropores and voids in 5052 aluminum alloys during tensile deformation
Size and distribution of micropores and voids in 5052 aluminum alloys during tensile deformation
Hojo, Tomohiko (Autor:in) / Kikuchi, Mamoru (Autor:in) / Shimizu, Kazuyuki (Autor:in) / Toda, Hiroyuki (Autor:in) / Takeuchi, Akihisa (Autor:in) / Akiyama, Eiji (Autor:in)
Keikinzoku ; 68 ; 630-634
01.01.2018
5 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
623.8945
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