Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Duty Cycle on Microstructure, Tungsten Content and Wear Resistance of Tungsten-Cobalt Films Prepared by Electrodeposition
Effect of Duty Cycle on Microstructure, Tungsten Content and Wear Resistance of Tungsten-Cobalt Films Prepared by Electrodeposition
Effect of Duty Cycle on Microstructure, Tungsten Content and Wear Resistance of Tungsten-Cobalt Films Prepared by Electrodeposition
Lu, Haipeng (Autor:in) / Qin, Junqi (Autor:in) / Di, Changchun (Autor:in) / Yang, Yuliang (Autor:in) / Huo, Ruikun (Autor:in)
Materials transactions ; 59 ; 1943-1948
01.01.2018
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
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