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Effects of void–crack interaction and void distribution on crack propagation in single crystal silicon
Effects of void–crack interaction and void distribution on crack propagation in single crystal silicon
Effects of void–crack interaction and void distribution on crack propagation in single crystal silicon
Wang, Liang (Autor:in) / Liu, Qunfeng (Autor:in) / Shen, Shengping (Autor:in)
Engineering fracture mechanics ; 146 ; 56-66
01.01.2015
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.112605
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