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Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
Azar, Amin S. (Autor:in) / Holme, Børge (Autor:in) / Nielsen, Øyvind (Autor:in)
Engineering fracture mechanics ; 154 ; 262-271
01.01.2016
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.112605
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