Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Stress Analysis of an Embedded Crack in a Graded Orthotropic Coating-Substrate Structure
Thermal Stress Analysis of an Embedded Crack in a Graded Orthotropic Coating-Substrate Structure
Thermal Stress Analysis of an Embedded Crack in a Graded Orthotropic Coating-Substrate Structure
Ding, Sheng-Hu (Autor:in) / Zhou, Yue-Ting (Autor:in) / Li, Xing (Autor:in)
Journal of thermal stresses ; 38 ; 1005-1021
01.01.2015
17 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1121
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Crack Problem for a Functionally Graded Orthotropic Coating-Substrate Structure
| British Library Online Contents | 2007
| British Library Online Contents | 2005
Transient Thermal Stress Analysis of Orthotropic Functionally Graded Materials with a Crack
| British Library Online Contents | 2007
Analysis of a propagating crack tip in orthotropic functionally graded materials
| British Library Online Contents | 2016
Analysis of a propagating crack tip in orthotropic functionally graded materials
| British Library Online Contents | 2016