Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering
Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering
Full densification of inkjet-printed copper conductive tracks on a flexible substrate utilizing a hydrogen plasma sintering
Kwon, Young-Tae (Autor:in) / Lee, Young-In (Autor:in) / Kim, Seil (Autor:in) / Lee, Kun-Jae (Autor:in) / Choa, Yong-Ho (Autor:in)
Applied surface science ; 396 ; 1239-1244
01.01.2017
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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