Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
TEM observation of general growth behavior for silver electroplating on copper rod
TEM observation of general growth behavior for silver electroplating on copper rod
TEM observation of general growth behavior for silver electroplating on copper rod
Li, Taotao (Autor:in) / Dang, Ning (Autor:in) / Liang, Miaomiao (Autor:in) / Guo, Chunli (Autor:in) / Lu, Huihu (Autor:in) / Ma, Jingyu (Autor:in) / Liang, Wei (Autor:in)
Applied surface science ; 451 ; 148-154
01.01.2018
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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