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Electrodeposition efficiency of Ni in the fabrication of highly ordered nanowire arrays: The roles of Cu pre-plating and barrier layer temperature
Electrodeposition efficiency of Ni in the fabrication of highly ordered nanowire arrays: The roles of Cu pre-plating and barrier layer temperature
Electrodeposition efficiency of Ni in the fabrication of highly ordered nanowire arrays: The roles of Cu pre-plating and barrier layer temperature
Ahmadzadeh, M. (Autor:in) / Almasi-Kashi, M. (Autor:in) / Ramazani, A. (Autor:in) / Montazer, A.H. (Autor:in)
Applied surface science ; 356 ; 687-694
01.01.2015
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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