Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Evolution of stacking fault tetrahedral and work hardening effect in copper single crystals
Evolution of stacking fault tetrahedral and work hardening effect in copper single crystals
Evolution of stacking fault tetrahedral and work hardening effect in copper single crystals
Liu, Hai Tao (Autor:in) / Zhu, Xiu Fu (Autor:in) / Sun, Ya Zhou (Autor:in) / Xie, Wen Kun (Autor:in)
Applied surface science ; 422 ; 413-419
01.01.2017
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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