Thermally conductive composite film filled with highly dispersed graphene nanoplatelets via solvent-free one-step fabrication: Fid-Bau Portal

Thermally conductive composite film filled with highly dispersed graphene nanoplatelets via solvent-free one-step fabrication

Yu, Jaesang / Cha, Ji Eun / Kim, Seong Yun

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Thermally conductive composite film filled with highly dispersed graphene nanoplatelets via solvent-free one-step fabrication

Yu, Jaesang / Cha, Ji Eun / Kim, Seong Yun

Thermally conductive composite film filled with highly dispersed graphene nanoplatelets via solvent-free one-step fabrication

Yu, Jaesang / Cha, Ji Eun / Kim, Seong Yun

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Thermally conductive composite film filled with highly dispersed graphene nanoplatelets via solvent-free one-step fabrication

Beteiligte:

Yu, Jaesang (Autor:in) / Cha, Ji Eun (Autor:in) / Kim, Seong Yun (Autor:in)

Erschienen in:

Composites.Part B, Engineering ; 110 ; 171-177

Erscheinungsdatum:

01.01.2017

Format / Umfang:

7 pages

ISSN:

1359-8368

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.118

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