Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
Zhang, Q.K. (Autor:in) / Hu, F.Q. (Autor:in) / Song, Z.L. (Autor:in) / Zhang, Z.F. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 701 ; 187-195
01.01.2017
9 pages
Aufsatz (Zeitschrift)
Unbekannt
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