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The influence of grain boundaries and grain orientations on the stochastic responses to low load nanoindentation in Cu
The influence of grain boundaries and grain orientations on the stochastic responses to low load nanoindentation in Cu
The influence of grain boundaries and grain orientations on the stochastic responses to low load nanoindentation in Cu
Schuessler, B.J. (Autor:in) / Wo, P.C. (Autor:in) / Zbib, H.M. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 715 ; 226-235
01.01.2018
10 pages
Aufsatz (Zeitschrift)
Unbekannt
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