Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ultrasonication pretreatment of diamond wire sawn multi-crystalline silicon wafers for texturing
Ultrasonication pretreatment of diamond wire sawn multi-crystalline silicon wafers for texturing
Ultrasonication pretreatment of diamond wire sawn multi-crystalline silicon wafers for texturing
Zhang, Jinbing (Autor:in) / Peng, Yeqing (Autor:in) / Ye, Xingfang (Autor:in) / Zhou, Xiaoying (Autor:in) / Hao, Gang (Autor:in) / Zhou, Lang (Autor:in)
Materials science in semiconductor processing ; 74 ; 292-296
01.01.2018
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2016
|British Library Online Contents | 2016
|Fracture strength of silicon wafers sawn by fixed diamond wire saw
British Library Online Contents | 2017
|Fracture strength of silicon wafers sawn by fixed diamond wire saw
British Library Online Contents | 2017
|Prediction of the thickness for silicon wafers sawn by diamond wire saw
British Library Online Contents | 2017
|