Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
High-temperature internal friction and dynamic moduli in copper
High-temperature internal friction and dynamic moduli in copper
High-temperature internal friction and dynamic moduli in copper
David, Emmanuel C. (Autor:in) / Jackson, Ian (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 730 ; 425-437
01.01.2018
13 pages
Aufsatz (Zeitschrift)
Unbekannt
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