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Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper
Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper
Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper
Wang, Quanlong (Autor:in) / Bai, Qingshun (Autor:in) / Chen, Jiaxuan (Autor:in) / Guo, Yongbo (Autor:in) / Xie, Wenkun (Autor:in)
Applied surface science ; 355 ; 1153-1160
01.01.2015
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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