Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air
Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air
Fabrication of reliable Cu-Cu joints by low temperature bonding isopropanol stabilized Cu nanoparticles in air
Mou, Yun (Autor:in) / Cheng, Hao (Autor:in) / Peng, Yang (Autor:in) / Chen, Mingxiang (Autor:in)
MATERIALS LETTERS ; 229 ; 353-356
01.01.2018
4 pages
Aufsatz (Zeitschrift)
Unbekannt
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