Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles
Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles
Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles
Li, Jiujuan (Autor:in) / Zhou, Guoyun (Autor:in) / Jin, Xiaofeng (Autor:in) / Hong, Yan (Autor:in) / He, Wei (Autor:in) / Wang, Shouxu (Autor:in) / Chen, Yuanming (Autor:in) / Yang, Wenjun (Autor:in) / Su, Xinhong (Autor:in)
Composites.Part B, Engineering ; 154 ; 257-262
01.01.2018
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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