Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Electric current induced thermal stress around a bi-material interface crack
Electric current induced thermal stress around a bi-material interface crack
Electric current induced thermal stress around a bi-material interface crack
Song, K. (Autor:in) / Song, H.P. (Autor:in) / Schiavone, P. (Autor:in) / Gao, C.F. (Autor:in)
Engineering fracture mechanics ; 208 ; 1-12
01.01.2019
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.112605
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