Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
On the contact and adhesion of a piezoelectric half-space under a rigid punch with an axisymmetric power-law profile
On the contact and adhesion of a piezoelectric half-space under a rigid punch with an axisymmetric power-law profile
On the contact and adhesion of a piezoelectric half-space under a rigid punch with an axisymmetric power-law profile
Jin, Fan (Autor:in) / Yan, Shunping (Autor:in) / Guo, Xu (Autor:in) / Wang, Xiaoyuan (Autor:in)
Mechanics of materials ; 129 ; 189-197
01.01.2019
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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