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Nanoindentation creep behavior and its relation to activation volume and strain rate sensitivity of nanocrystalline Cu
Nanoindentation creep behavior and its relation to activation volume and strain rate sensitivity of nanocrystalline Cu
Nanoindentation creep behavior and its relation to activation volume and strain rate sensitivity of nanocrystalline Cu
Sun, Weiming (Autor:in) / Jiang, Yue (Autor:in) / Sun, Guixun (Autor:in) / Hu, Jiangjiang (Autor:in) / Zhou, Tianyi (Autor:in) / Jiang, Zhonghao (Autor:in) / Lian, Jianshe (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 751 ; 35-41
01.01.2019
7 pages
Aufsatz (Zeitschrift)
Unbekannt
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