Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Paper ID 210468 Validated Simulation of Low Cost Thermal Envelope Upgrades for Slum Housing
Paper ID 210468 Validated Simulation of Low Cost Thermal Envelope Upgrades for Slum Housing
Paper ID 210468 Validated Simulation of Low Cost Thermal Envelope Upgrades for Slum Housing
Bonaccorso, Nadir (Autor:in) / Martins, Nuno R. (Autor:in) / Graca, Guilherme Carrilho da (Autor:in)
Building Simulation ; 16. ; 2019 ; Rom
2020
Aufsatz (Konferenz)
Englisch
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