GROUND IMPROVEMENT EFFECT OF TIMBER PILES BURIED IN SOFT CLAY GROUND: Fid-Bau Portal

GROUND IMPROVEMENT EFFECT OF TIMBER PILES BURIED IN SOFT CLAY GROUND

Hara, Tadashi / Kubojima, Yoshitaka / Kato, Hidao / Sonoda, Satomi

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GROUND IMPROVEMENT EFFECT OF TIMBER PILES BURIED IN SOFT CLAY GROUND

Hara, Tadashi / Kubojima, Yoshitaka / Kato, Hidao / Sonoda, Satomi

GROUND IMPROVEMENT EFFECT OF TIMBER PILES BURIED IN SOFT CLAY GROUND

Hara, Tadashi / Kubojima, Yoshitaka / Kato, Hidao / Sonoda, Satomi

Zugriff

Seitennavigation

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

GROUND IMPROVEMENT EFFECT OF TIMBER PILES BURIED IN SOFT CLAY GROUND

Beteiligte:

Kongress:

World Conference on Timber Engineering ; 13. ; 2023 ; Oslo

Erschienen in:

Timber for a livable future ; Volume 2

Erscheinungsdatum:

2023

Medientyp:

Aufsatz (Konferenz)

Format:

Sprache:

Englisch

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