Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Performance Evaluations of Pavement Underlying Chip-Seal: Laboratory Testing on Pavement Cores
The objective of this study is to preliminarily analyze the premature stripping in asphalt pavement underlying chip-seal, based on laboratory testing on pavement cores from Minnesota. The newly developed Michigan Tech’s interface bond test (IBT) was used in characterizing the interface bond strength of chip-seal and the direct tensile strength of asphalt pavements. It should be noted that when the direct tensile strength of the asphalt pavement was evaluated via the testing set-up of IBT, the fractures occurred in the asphalt pavement, not in the chip-seal. Based on the laboratory results, it is concluded that if there is no damage to the chip-seals, the chip-seals will be excellent in protecting the asphalt pavement. In contrast, if partial damage occurs in the chip-seal, this will accelerate the damage in the pavement.
Performance Evaluations of Pavement Underlying Chip-Seal: Laboratory Testing on Pavement Cores
The objective of this study is to preliminarily analyze the premature stripping in asphalt pavement underlying chip-seal, based on laboratory testing on pavement cores from Minnesota. The newly developed Michigan Tech’s interface bond test (IBT) was used in characterizing the interface bond strength of chip-seal and the direct tensile strength of asphalt pavements. It should be noted that when the direct tensile strength of the asphalt pavement was evaluated via the testing set-up of IBT, the fractures occurred in the asphalt pavement, not in the chip-seal. Based on the laboratory results, it is concluded that if there is no damage to the chip-seals, the chip-seals will be excellent in protecting the asphalt pavement. In contrast, if partial damage occurs in the chip-seal, this will accelerate the damage in the pavement.
Performance Evaluations of Pavement Underlying Chip-Seal: Laboratory Testing on Pavement Cores
You, Lingyun (Autor:in) / You, Zhanping (Autor:in) / Dai, Qingli (Autor:in)
International Conference on Transportation and Development 2020 ; 2020 ; Seattle, Washington (Conference Cancelled)
31.08.2020
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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