Thermal, electrical and wear behavior of sintered Cu

Thermal, electrical and wear behavior of sintered Cu–W nanocomposite

Selvakumar, N. / Vettivel, S.C.

Graphical abstract Display Omitted Highlights ► No work on thermal analysis test for sintered nanocomposite. ► Electrical resistivity has been discussed in detail for the composite. ► Polynomial and power law equation was developed by using curve fitting technique. ► Worn surface and wear debris has been discussed in detail using SEM.

Abstract High-energy mechanical milling was used to prepare Cu and W nanopowders. Cylindrical preforms with initial theoretical density of 86% were prepared using a die and punch assembly. The preforms were sintered in a muffle furnace and subsequently furnace cooled and then the hot specimens were extruded to attain 93% theoretical density. Differential Scanning Calorimetry and Thermal Gravimetric Analyzer, four point probe tester, Scanning Electron Microscope and pin on-disc system were used to evaluate the thermal, electrical conductivity, characterization and tribological property of Cu–W composite respectively and using curve fitting method the respective polynomial and power law model were developed. The results indicated that the wear rate decreased with increasing applied load and sliding distance. The composites were tested at high sliding speed which exhibited high value of coefficient of friction.