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Effects of TiN nanoparticles on the microstructure and properties of W–30Cu composites prepared via electroless plating and powder metallurgy
Graphical abstract Display Omitted
Highlights TiN-doped W–Cu composite was successfully prepared by electroless plating and powder metallurgy. TiN-doped W–Cu significantly affected the microstructureand properties of the composites. W–Cu composite with 0.25wt.% TiN possesses the best comprehensive performance.
Abstract W–30Cu/(0, 0.25, 0.5, 1, and 2)wt.% TiN composites were prepared via electroless plating with simplified pretreatment and powder metallurgy. The phase and morphology of W–Cu/TiN composite powders and sintered W–Cu/TiN samples were characterized via X-ray diffraction and field emission scanning electron microscopy. Transmission electron microscopy was performed to characterize the microstructure of the sintered W–Cu/TiN samples. The relative density, hardness, electrical conductivity, and compressive strength of the sintered samples were examined. Results showed that W–30Cu composite powders with a uniform structure can be obtained using W powder pretreated with nitric acid, ammonium fluoride, and hydrofluoric acid followed by electroless Cu plating. The addition of TiN nanoparticles significantly affected the microstructure and properties of the W–30Cu composites. A good combination of the compressive strength and hardness of the W–30Cu composite material can be obtained by incorporating the TiN additive at 0.25wt.%. However, the relative density and electrical conductivity slightly decreased.
Effects of TiN nanoparticles on the microstructure and properties of W–30Cu composites prepared via electroless plating and powder metallurgy
Graphical abstract Display Omitted
Highlights TiN-doped W–Cu composite was successfully prepared by electroless plating and powder metallurgy. TiN-doped W–Cu significantly affected the microstructureand properties of the composites. W–Cu composite with 0.25wt.% TiN possesses the best comprehensive performance.
Abstract W–30Cu/(0, 0.25, 0.5, 1, and 2)wt.% TiN composites were prepared via electroless plating with simplified pretreatment and powder metallurgy. The phase and morphology of W–Cu/TiN composite powders and sintered W–Cu/TiN samples were characterized via X-ray diffraction and field emission scanning electron microscopy. Transmission electron microscopy was performed to characterize the microstructure of the sintered W–Cu/TiN samples. The relative density, hardness, electrical conductivity, and compressive strength of the sintered samples were examined. Results showed that W–30Cu composite powders with a uniform structure can be obtained using W powder pretreated with nitric acid, ammonium fluoride, and hydrofluoric acid followed by electroless Cu plating. The addition of TiN nanoparticles significantly affected the microstructure and properties of the W–30Cu composites. A good combination of the compressive strength and hardness of the W–30Cu composite material can be obtained by incorporating the TiN additive at 0.25wt.%. However, the relative density and electrical conductivity slightly decreased.
Effects of TiN nanoparticles on the microstructure and properties of W–30Cu composites prepared via electroless plating and powder metallurgy
Huang, Li-Mei (Autor:in) / Luo, Lai-Ma (Autor:in) / Zhao, Mei-Ling (Autor:in) / Luo, Guang-Nan (Autor:in) / Zhu, Xiao-Yong (Autor:in) / Cheng, Ji-Gui (Autor:in) / Zan, Xiang (Autor:in) / Wu, Yu-Cheng (Autor:in)
07.05.2015
5 pages
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch
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