The relationship between thermal comfort, performance, and electroencephalogram during cognitive tests at normal indoor temperatures in summer: Fid-Bau Portal

The relationship between thermal comfort, performance, and electroencephalogram during cognitive tests at normal indoor temperatures in summer

Liu, Weiwei / Wu, Yifeng / Shi, Lei / Li, Jiang / Wang, Zheng / Tian, Xiaoyu

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The relationship between thermal comfort, performance, and electroencephalogram during cognitive tests at normal indoor temperatures in summer

Liu, Weiwei / Wu, Yifeng / Shi, Lei / Li, Jiang / Wang, Zheng / Tian, Xiaoyu

The relationship between thermal comfort, performance, and electroencephalogram during cognitive tests at normal indoor temperatures in summer

Liu, Weiwei / Wu, Yifeng / Shi, Lei / Li, Jiang / Wang, Zheng / Tian, Xiaoyu

Zugriff

Zugriff prüfen

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Ähnliche Titel

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Titel:

The relationship between thermal comfort, performance, and electroencephalogram during cognitive tests at normal indoor temperatures in summer

Weitere Titelangaben:

Building and Environment

Beteiligte:

Liu, Weiwei (Autor:in) / Wu, Yifeng (Autor:in) / Shi, Lei (Autor:in) / Li, Jiang (Autor:in) / Wang, Zheng (Autor:in) / Tian, Xiaoyu (Autor:in)

Erschienen in:

Building and Environment ; 257

Erscheinungsdatum:

01.06.2024

ISSN:

0360-1323

DOI:

https://doi.org/10.1016/j.buildenv.2024.111567

Medientyp:

Aufsatz (Zeitschrift)

Format:

Elektronische Ressource

Sprache:

Englisch

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