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Isogeometric analysis of magneto-electro-elastic functionally graded Mindlin microplates
Highlights A new isogeometric analysis model for MEEFG microplate is proposed. Static and dynamic responses with square and elliptical plates are investigated. The accuracy and convergence of the numerical solution are verified. The microstructure effect becomes more pronounced as the structure size and stiffness decrease. Adjusting the graded index can improve the mechanical and electromagnetic properties of the plate.
Abstract In this study, an accurate numerical method for the static and dynamic response analysis of magneto-electro-elastic functionally graded (MEEFG) microplates with complex geometries is proposed with the application of isogeometric analysis (IGA). Leveraging Hamilton's principle and the extended modified couple stress theory, the weak form of motion equations is derived. By performing convergence analysis, the accuracy of the proposed numerical method is verified. To show the applicability of the new method, the influences of the microstructure effect and gradient index on the static and dynamic behaviors of both the MEEFG square and elliptical microplates with various boundary conditions are discussed in detail. Results illustrate that the microstructure effect dominated by the couple stress effect has an obvious impact on both the mechanical and electromagnetic behavior of structures with microscopic scales which will cause hardening of microstructural stiffness, whereas the macrostructures are minimally affected by the couple stress effect. Besides, microstructures with lower stiffness exhibit a more pronounced microstructure effect and a greater degree of stiffness hardening. The proposed IGA method could serve as a basis for the design and optimization of microelectromechanical devices with complex shapes.
Isogeometric analysis of magneto-electro-elastic functionally graded Mindlin microplates
Highlights A new isogeometric analysis model for MEEFG microplate is proposed. Static and dynamic responses with square and elliptical plates are investigated. The accuracy and convergence of the numerical solution are verified. The microstructure effect becomes more pronounced as the structure size and stiffness decrease. Adjusting the graded index can improve the mechanical and electromagnetic properties of the plate.
Abstract In this study, an accurate numerical method for the static and dynamic response analysis of magneto-electro-elastic functionally graded (MEEFG) microplates with complex geometries is proposed with the application of isogeometric analysis (IGA). Leveraging Hamilton's principle and the extended modified couple stress theory, the weak form of motion equations is derived. By performing convergence analysis, the accuracy of the proposed numerical method is verified. To show the applicability of the new method, the influences of the microstructure effect and gradient index on the static and dynamic behaviors of both the MEEFG square and elliptical microplates with various boundary conditions are discussed in detail. Results illustrate that the microstructure effect dominated by the couple stress effect has an obvious impact on both the mechanical and electromagnetic behavior of structures with microscopic scales which will cause hardening of microstructural stiffness, whereas the macrostructures are minimally affected by the couple stress effect. Besides, microstructures with lower stiffness exhibit a more pronounced microstructure effect and a greater degree of stiffness hardening. The proposed IGA method could serve as a basis for the design and optimization of microelectromechanical devices with complex shapes.
Isogeometric analysis of magneto-electro-elastic functionally graded Mindlin microplates
Wang, Shaopeng (Autor:in) / Hong, Jun (Autor:in) / Yin, Shuohui (Autor:in) / Zhang, Gongye (Autor:in)
Thin-Walled Structures ; 198
21.02.2024
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch
Post-buckling Analysis of Circular Functionally Graded Microplates Based on Isogeometric Analysis
Springer Verlag | 2022
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