Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SUBFLOOR COMPONENT AND METHOD OF MANUFACTURING SAME
A subfloor component comprises a hardboard panel having first and second opposing faces and a plurality of intersecting grooves to define, in cross- section, a plurality of pedestals having walls that extend into the panel from the first face toward the second face. The subfloor component also comprises a film of substantially moisture-impervious material attached to the first face of the panel and that conforms to the tops and walls of the pedestals and to the bottoms of the grooves.
SUBFLOOR COMPONENT AND METHOD OF MANUFACTURING SAME
A subfloor component comprises a hardboard panel having first and second opposing faces and a plurality of intersecting grooves to define, in cross- section, a plurality of pedestals having walls that extend into the panel from the first face toward the second face. The subfloor component also comprises a film of substantially moisture-impervious material attached to the first face of the panel and that conforms to the tops and walls of the pedestals and to the bottoms of the grooves.
SUBFLOOR COMPONENT AND METHOD OF MANUFACTURING SAME
COMPOSANTE DE SOUS-PLANCHER ET METHODE DE FABRICATION ASSOCIEE
AMEND VICTOR (Autor:in)
04.10.2016
Patent
Elektronische Ressource
Englisch
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
B27M
Holzbearbeitung, soweit nicht in den Unterklassen B27B-B27L vorgesehen
,
WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B-B27L
/
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS