Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Waterproof and heat insulating floor tile provided with wiring pipeline
The invention relates to the technical field of building materials and in particular relates to a waterproof and heat insulating floor tile provided with a wiring pipeline. The waterproof and heat insulating floor tile provided with the wiring pipeline comprises a surface-layer brick body and a bottom-layer brick body which are adhered and fixed together by virtue of an adhesive, wherein the bottom-layer brick body is a foam concrete brick body, the surface-layer brick body is a waterproof enamel layer brick body, and splicing embossments are arranged at the middle parts of one pair of side vertical surfaces, which are vertical to each other, of the bottom-layer brick body; splicing grooves are formed in the middle parts of another pair of side vertical surfaces, which are vertical to each other, of the bottom-layer brick body; and the wiring pipeline is arranged inside the bottom-layer brick body. The waterproof and heat insulating floor tile provided with the wiring pipeline has good waterproof, heating insulating and water absorbing effects, the splicing embossments and the splicing grooves of the side vertical surfaces of the bottom-layer brick body enable floor tiles to be aligned to each other conveniently when the floor tiles are laid in a large area, the firmness of the laid brick bodies can be enhanced, and a power line and a network cable can be conveniently laid as the wiring pipeline is arranged inside the bottom-layer brick body.
Waterproof and heat insulating floor tile provided with wiring pipeline
The invention relates to the technical field of building materials and in particular relates to a waterproof and heat insulating floor tile provided with a wiring pipeline. The waterproof and heat insulating floor tile provided with the wiring pipeline comprises a surface-layer brick body and a bottom-layer brick body which are adhered and fixed together by virtue of an adhesive, wherein the bottom-layer brick body is a foam concrete brick body, the surface-layer brick body is a waterproof enamel layer brick body, and splicing embossments are arranged at the middle parts of one pair of side vertical surfaces, which are vertical to each other, of the bottom-layer brick body; splicing grooves are formed in the middle parts of another pair of side vertical surfaces, which are vertical to each other, of the bottom-layer brick body; and the wiring pipeline is arranged inside the bottom-layer brick body. The waterproof and heat insulating floor tile provided with the wiring pipeline has good waterproof, heating insulating and water absorbing effects, the splicing embossments and the splicing grooves of the side vertical surfaces of the bottom-layer brick body enable floor tiles to be aligned to each other conveniently when the floor tiles are laid in a large area, the firmness of the laid brick bodies can be enhanced, and a power line and a network cable can be conveniently laid as the wiring pipeline is arranged inside the bottom-layer brick body.
Waterproof and heat insulating floor tile provided with wiring pipeline
CHE GUORONG (Autor:in)
30.09.2015
Patent
Elektronische Ressource
Englisch
IPC:
E01C
Bau von Straßen, Sportplätzen oder dgl., Decken dafür
,
CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse