Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention discloses a ceiling board structure which comprises a board body. Grooves are formed in the periphery of the board body, and through holes are formed in the two ends of each groove. When wires are distributed, the wires stretch into the grooves from the through holes, so that the directions of the wires are conveniently fixed, and moreover the condition that wires are exposed outside and affect attractiveness is avoided.
The invention discloses a ceiling board structure which comprises a board body. Grooves are formed in the periphery of the board body, and through holes are formed in the two ends of each groove. When wires are distributed, the wires stretch into the grooves from the through holes, so that the directions of the wires are conveniently fixed, and moreover the condition that wires are exposed outside and affect attractiveness is avoided.
Ceiling board structure
WANG DONGPING (Autor:in)
07.10.2015
Patent
Elektronische Ressource
Englisch
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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