Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention relates to the field of a thermal insulation technology, especially to a thermal insulation wallboard. The thermal insulation wallboard comprises a first layer, a second layer and a third layer. The thermal insulation wallboard is molded by single pressing of sandwiching the second layer between the first layer and the third layer. The material of the first and third layers is phenolic foam, and the material of the second layer is aerogel felt. The outer side of the first layer is provided with a bonding layer, and the material of the bonding layer is anti-crack mortar. The thermal insulation wallboard has high strength, is a wallboard for multi-layer insulation, and will not transfer heat after exposed to sunlight. Thus, temperature difference in a tower is not influenced.
The invention relates to the field of a thermal insulation technology, especially to a thermal insulation wallboard. The thermal insulation wallboard comprises a first layer, a second layer and a third layer. The thermal insulation wallboard is molded by single pressing of sandwiching the second layer between the first layer and the third layer. The material of the first and third layers is phenolic foam, and the material of the second layer is aerogel felt. The outer side of the first layer is provided with a bonding layer, and the material of the bonding layer is anti-crack mortar. The thermal insulation wallboard has high strength, is a wallboard for multi-layer insulation, and will not transfer heat after exposed to sunlight. Thus, temperature difference in a tower is not influenced.
Thermal insulation wallboard
ZHOU CHANGRONG (Autor:in)
28.10.2015
Patent
Elektronische Ressource
Englisch
IPC:
E04C
STRUCTURAL ELEMENTS
,
Bauelemente