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Method of forming adhesive connections
The present disclosure relates to a composite assembly comprising an optically transparent substrate. The present disclosure is also directed to a method of forming an adhesive connection between an optically transparent substrate and a second substrate.
Method of forming adhesive connections
The present disclosure relates to a composite assembly comprising an optically transparent substrate. The present disclosure is also directed to a method of forming an adhesive connection between an optically transparent substrate and a second substrate.
Method of forming adhesive connections
BALLESTEROS FERNANDO (Autor:in) / FERNANDEZ MARIANO (Autor:in) / GARCIA HENRI (Autor:in)
18.11.2015
Patent
Elektronische Ressource
Englisch
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
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