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Flake alumina porous ceramic used for high-power LED lamp chip heat dissipation, and preparation method thereof
The invention discloses a flake alumina porous ceramic used for high-power LED lamp chip heat dissipation. The flake alumina porous ceramic is prepared from, by weight, 34 to 36 parts of alpha-Al2O3 (particle size ranging from 2 to 8m), 100 to 105 parts of deionized water, 0.2 to 0.3 part of sodium polyacrylate, 2 to 2.3 parts of methylcellulose, 1.6 to 1.8 parts of glycerin, 1.4 to 1.6 parts of LiSbO3, 2 to 3 parts of potassium-sodium niobate, 0.4 to 0.6 part of CaF2, 1.5 to 1.8 parts of reductive iron powder, 4 to 5 parts of nano-aluminium hydroxide, 1.2 to 1.5 parts of nano-copper, and 0.9 to 1.1 parts of PVA binder. Compatibility of ceramic with metal is improved via adding nano-copper into the flake alumina porous ceramic; ceramic thermal conductivity and recombination property with metal are improved greatly via adding of LiSbO3, potassium-sodium niobate, CaF2, and reductive iron powder; and the flake alumina porous ceramic is suitable for high-power LED chip heat dispersion.
Flake alumina porous ceramic used for high-power LED lamp chip heat dissipation, and preparation method thereof
The invention discloses a flake alumina porous ceramic used for high-power LED lamp chip heat dissipation. The flake alumina porous ceramic is prepared from, by weight, 34 to 36 parts of alpha-Al2O3 (particle size ranging from 2 to 8m), 100 to 105 parts of deionized water, 0.2 to 0.3 part of sodium polyacrylate, 2 to 2.3 parts of methylcellulose, 1.6 to 1.8 parts of glycerin, 1.4 to 1.6 parts of LiSbO3, 2 to 3 parts of potassium-sodium niobate, 0.4 to 0.6 part of CaF2, 1.5 to 1.8 parts of reductive iron powder, 4 to 5 parts of nano-aluminium hydroxide, 1.2 to 1.5 parts of nano-copper, and 0.9 to 1.1 parts of PVA binder. Compatibility of ceramic with metal is improved via adding nano-copper into the flake alumina porous ceramic; ceramic thermal conductivity and recombination property with metal are improved greatly via adding of LiSbO3, potassium-sodium niobate, CaF2, and reductive iron powder; and the flake alumina porous ceramic is suitable for high-power LED chip heat dispersion.
Flake alumina porous ceramic used for high-power LED lamp chip heat dissipation, and preparation method thereof
DONG ZHAOHAI (Autor:in)
02.12.2015
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
| Europäisches Patentamt | 2015
| Europäisches Patentamt | 2015
| Europäisches Patentamt | 2015
| Europäisches Patentamt | 2015
| Europäisches Patentamt | 2015