Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention discloses a heat preservation paperboard, which is characterized by comprising an upper surface layer, a lower surface layer, and an insulating layer arranged between the upper surface layer and the lower surface layer. According to the heat preservation paper board provided by the invention, a packaging layer is additionally arranged in a carton body, due to the fact that thermal insulation materials do not need to be extra added, so that the packaging carton is simple in structure, convenient to operate, and the packaging cost is greatly reduced.
The invention discloses a heat preservation paperboard, which is characterized by comprising an upper surface layer, a lower surface layer, and an insulating layer arranged between the upper surface layer and the lower surface layer. According to the heat preservation paper board provided by the invention, a packaging layer is additionally arranged in a carton body, due to the fact that thermal insulation materials do not need to be extra added, so that the packaging carton is simple in structure, convenient to operate, and the packaging cost is greatly reduced.
Heat preservation paperboard
FENG WENTIAN (Autor:in)
30.12.2015
Patent
Elektronische Ressource
Englisch
Honeycomb‐Paperboard Glass Composite Beams
| Wiley | 2018
Rapeseed Proteins for Paperboard Coating
| Wiley | 2014
ARKITEKT MAGASINET: Iggesund Paperboard, Iggesund.
Online Contents | 1996