Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
High-power LED (Light-Emitting Diode) heat dissipation ceramic substrate
The invention belongs to the technical field of ceramic substrates, and particularly relates to a high-power LED (Light-Emitting Diode) heat dissipation ceramic substrate. The ceramic substrate comprises the following materials in percentage by mass: 70-80 percent of alumina powder, 3-8 percent of melamine, 3-6 percent of hydroxymethyl cellulose, 6-10 percent of deionized water and 5-10 percent of composite sintering aid, wherein the composite sintering aid comprises the following materials in percentage by mass: 40-60 percent of silicon powder, 5-10 percent of aluminum powder, 20-30 percent of kaolin powder and 10-30 percent of calcium fluoride. The ceramic substrate has the advantages of high heat conductivity coefficient, excellent heat resistance, high bending strength and avoidance of the phenomena of bending, wrapping and the like. Through adoption of an appropriate sintering method and selection of an appropriate sintering aid, denseness of an alumina ceramic sintered body is realized, and the heat conductivity of alumina ceramics is increased greatly.
High-power LED (Light-Emitting Diode) heat dissipation ceramic substrate
The invention belongs to the technical field of ceramic substrates, and particularly relates to a high-power LED (Light-Emitting Diode) heat dissipation ceramic substrate. The ceramic substrate comprises the following materials in percentage by mass: 70-80 percent of alumina powder, 3-8 percent of melamine, 3-6 percent of hydroxymethyl cellulose, 6-10 percent of deionized water and 5-10 percent of composite sintering aid, wherein the composite sintering aid comprises the following materials in percentage by mass: 40-60 percent of silicon powder, 5-10 percent of aluminum powder, 20-30 percent of kaolin powder and 10-30 percent of calcium fluoride. The ceramic substrate has the advantages of high heat conductivity coefficient, excellent heat resistance, high bending strength and avoidance of the phenomena of bending, wrapping and the like. Through adoption of an appropriate sintering method and selection of an appropriate sintering aid, denseness of an alumina ceramic sintered body is realized, and the heat conductivity of alumina ceramics is increased greatly.
High-power LED (Light-Emitting Diode) heat dissipation ceramic substrate
ZUO SHIXIANG (Autor:in) / ZHANG YU (Autor:in) / WANG YONGFEI (Autor:in) / LYU LIECHAO (Autor:in) / YU LOUYUN (Autor:in) / YANG YANG (Autor:in)
27.01.2016
Patent
Elektronische Ressource
Englisch
IPC:
C04B
Kalk
,
LIME
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